Key Features
Dual socket R3 (LGA 2011) supports
Intel® Xeon® processor E5-2600
v4†/ v3 family; UPI up to 9.6GT/s
Intel® C612 chipset
Up to 2TB† ECC 3DS LRDIMM , up to
DDR4- 2400†MHz; 16 DIMM slots
1 PCI-E 3.0 x32 Left riser slot
1 PCI-E 3.0 x8 Right riser slot
1 PCI-E 3.0 x8 for Add-On-Module
Intel® i350 Dual port GbE LAN
10 SATA3 (6Gbps); RAID 0, 1, 5, 10
Integrated IPMI 2.0 and KVM with
Dedicated LAN
3 USB 3.0 (2 rear, 1 Type A);
4 USB 2.0 (2 rear, 2 via header)
Product SKUs
MBD-X10DDW-i
X10DDW-i
Physical Stats
Form Factor
Proprietary WIO
Dimensions
12" x 9.6" (30.48cm x 24.4cm)
Processor/Cache
CPU
Intel® Xeon® processor E5-2600 v3, Intel® Xeon® processor E5-2600 v4.
Dual Socket R3 (LGA 2011) supported, CPU TDP support Up to 160W, 1 QPI up to 9.6GT/s
Cores / Cache
Up to 22 cores † / Up to 55MB† cache
Note
† BIOS version 2.0 or above is required
Note
** Motherboard supports this maximum TDP. Please verify your system can thermally support.
System Memory
Memory Capacity
Up to 1TB Registered ECC RDIMM, DDR4-2400MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2400MHz, in 16 DIMM slots
Memory Type
2400†/2133/1866/1600MHz ECC DDR4 SDRAM 72-bit
DIMM Sizes
RDIMM: 4GB, 8GB, 16GB, 32GB, 64GB
LRDIMM: 32GB, 64GB
3DS LRDIMM: 128GB
Memory Voltage
1.2V
Error Detection
Corrects single-bit errors
Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset
Intel® C226 Express PCH
AHCI SATA
SATA3 (6Gbps); RAID 0, 1, 5, 10
SCU SATA
SATA3 (6Gbps); RAID 0, 1, 5, 10
IPMI
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
ASPEED AST2400 BMC
Network Controllers
Dual LAN with Intel® i350 Gigabit Ethernet Controller
Single LAN with Virtual Machine Device Queues reduce I/O overhead
Single LAN with Supports 10Base-T, 100BASE-TX, and 1000BASE-T, RJ45 output
Single LAN with Realtek RTL8111E Gigabit Ethernet
Graphics
Aspeed AST2400 BMC
Input / Output
SATA
10 SATA3 (6Gbps) port
LAN
2 RJ45 Gigabit Ethernet LAN ports
1 RJ45 Dedicated IPMI LAN port
USB
4 USB 2.0 ports (2 rear + 2 headers)
3 USB 3.0 ports (2 rear + 1 Type A)
Video Output
1 VGA port
Serial Port / Header
1 COM Port (1 header)
1 fast UART 16550 serial
TPM
1 TPM Header
Expansion Slots
PCI-E
1 PCI-E 3.0 x8 Right Riser Slot,
1 PCI-E 3.0 x8 for Add-On-Module (AOM) Or 1 PCI-E 3.0 x32 Left Riser Slot
3 PCI-E 2.0 x1 (in x4 slot)
System BIOS
BIOS Type
128Mb SPI Flash EEPROM with AMI BIOS
BIOS Features
Plug and Play (PnP)
PCI 2.3
ACPI 1.0 / 2.0 / 3.0 / 4.0
USB Keyboard support
SMBIOS 2.7.1
UEFI 2.3.1
Management
Software
Intel® Node Manager, IPMI2.0, NMI, SPM, SUM, Watchdog
Power Configurations
ACPI Power Management
Power-on mode for AC power recovery
PC Health Monitoring
Voltage
+1.8V, +12V, +3.3V, +5V, +5V standby, 3.3V standby, 5 Phase-switching voltage regulator, Memory Voltages, VBAT
FAN
6x 4-pin fan headers (up to 6 fans), 6 fans with tachometer status monitoring, Pulse Width Modulated (PWM) fan connectors, Status monitoring for speed control
Temperature
Monitoring for CPU and chassis environment, CPU thermal trip support, Thermal Monitor 2 (TM2) support, PECI, Thermal Control for 6 Fan Connectors
LED
CPU / System Overheat LED, Suspend static indicator LED, UID/Remote UID
Other Features
Chassis intrusion detection, Chassis intrusion header, RoHS, SDDC
Operating Environment
Operating Temperature Range
10°C - 35°C (50°F - 95°F)
Non-Operating Temperature Range
-40°C - 70°C (-40°F - 158°F)
Operating Relative Humidity Range
8% - 90% (non-condensing)
Non-Operating Relative Humidity Range
5% - 95% (non-condensing)
Parts List (Bulk Package)
Name Part Number Qty Description
Motherboard MBD-X10DDW-i 1 X10DDW-i Motherboard
Parts List (Retail Package)
Name Part Number Qty Description
X10DDW-i MBD-X10DDW-i 1 X10DDW-i Motherboard
I/O Cables CBL-SAST-0644 2 RA IPASS TO 4 SATA, 75/75/90/90cm w/90cm SB, 30AWG
Quick Reference Guide MNL-1572-QRG 1 Quick Reference Guide
Optional Parts List
Name Part Number Qty Description
TPM security module (optional, not included) AOM-TPM-9655V LPC capable TPM 1.2 with Infineon 9655 controller with verticle form factor
TPM security module (optional, not included) AOM-TPM-9655H LPC capable TPM 1.2 with Infineon 9655 controller with horizontal form factor
TPM security module (optional, not included) AOM-TPM-9665V LPC capable TPM 2.0 with Infineon 9665 controller with verticle form factor
TPM security module (optional, not included) AOM-TPM-9665H LPC capable TPM 2.0 with Infineon 9665 controller with horizontal form factor
Add-on Module S3108 AOM-S3108M-H8 Broadcom® 3108, SS-3/Gen-3 12Gb/ROC
Chassis (Optimized for X10DDW-i)
Embedded Compact 1U 2U 3U Mid/Mini-Tower 4U/Tower
1U Heatsink:SNK-P0047PS
2U Heatsink:SNK-P0048PS
SC113TQ-600WB
SC815TQ-600WB
SC801STS-656DP
1U Heatsink:SNK-P0047PS
2U Heatsink:SNK-P0048PS
825TQ-R740WB
826BA-R920WB
213A-R740WB
216BA-R920LPB
826BAC4-R920WB
216BA-R920WB
1U Heatsink:SNK-P0047PS
2U Heatsink:SNK-P0048PS
Server (Optimized for X10DDW-i)
Server Name
SYS-6018R-TD8
SYS-6018R-TDW
SYS-1028R-TDW
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