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SUPERMICRO 

X11DSN-TS

- X11DSN-TS
X11DSN-TS
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Marques
SuperMicro
Carte Mère
Proprietaire
Socket
Socket P (LGA 3647)
Processeur
DP Double CPU

2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s


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  • Caractéristiques détaillées
Key Features
 
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C624
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
2 PCI-E 3.0 x16 Left Riser Slot
M.2 Interface: 1 PCI-E 3.0 x4
M.2 Form Factor: 2242/2260/2280
M.2 Key: M-Key
1 VGA D-Sub Connector port
Dual LAN with 10GBase-T with Intel® X557
 
 
Product SKUs
 
MBD-X11DSN-TS
X11DSN-TS
 
Physical Stats
 
Form Factor
Proprietary
Dimensions
11.5" x 13.9" (29.21cm x 35.31cm)
 
Processor/Cache
 
CPU
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Cores / Cache
Up to 28 cores
 
System Memory
 
Memory Capacity
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
Memory Type
2933/2666/2400/2133MHz ECC DDR4 RDIMM, LRDIMM
DIMM Sizes
RDIMM: 32GB, 64GB, 128GB
LRDIMM: 64GB, 128GB
3DS LRDIMM: 128GB, 256GB
Memory Voltage
1.2V
Error Detection
Corrects single-bit errors
Detects double-bit errors (using ECC memory)
 
On-Board Devices
 
Chipset
Intel® C624
IPMI
ASPEED AST2500
Network Controllers
Dual LAN with 10GBase-T with Intel® X557
Graphics
Aspeed AST2500 BMC
 
Input / Output
 
USB
3 USB 3.0 ports (2 rear + 1 Type A)
Video Output
1 VGA D-Sub Connector port
Serial Port / Header
2 COM Ports (1 rear, 1 header)
TPM
1 TPM Header
 
Expansion Slots
 
PCI-E
2 PCI-E 3.0 x16 Left Riser Slot
M.2
M.2 Interface: 1 PCI-E 3.0 x4
Form Factor: 2242/2260/2280
Key: M-Key
 
System BIOS
 
BIOS Type
AMI UEFI
 
Management
 
Software
Intel® Node Manager, IPMI (Intelligent Platform Management Interface) v2.0 with KVM support, IPMI2.0, KVM with dedicated LAN, NMI, SPM, SSM, SUM, SuperDoctor® 5, Watchdog
System Mangement Software
IPMI (Intelligent Platform Management Interface) v1.5 / 2.0 with KVM support
 
PC Health Monitoring
 
Voltage
+1.35V, +1.5V, +12V, +3.3V, +5V, +5V standby, 1.05 (PCH), 1.2V (VDIMM), Memory Voltages, Monitors CPU voltages, VBAT
FAN
4x 4-pin fan headers (up to 4 fans), Fan speed control, Overheat LED indication, PWM fan speed control
Temperature
N/A
LED
CPU / System Overheat LED, UID/Remote UID
Other Features
Chassis intrusion detection, Control of power-on for recovery from AC power loss, CPU thermal trip support for processor protection, Innovation Engine, Node Manager Support, RoHS, RoHS, Halogen Free, UID, WOL
 
Operating Environment
 
Operating Temperature Range
10°C - 35°C (50°F - 95°F)
Non-Operating Temperature Range
-20°C ~ 60°C (-4°F ~ 140°F)
Operating Relative Humidity Range
8% - 90% (non-condensing)
Non-Operating Relative Humidity Range
10% ~ 95% (non-condensing)
 
 
 
Parts List (Bulk Package)
Name Part Number Qty Description
Motherboard MBD-X11DSN-TS 1 X11DSN-TS Motherboard
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