Key Features
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
Intel® C621 Chipset
Expansion slots:
2 PCI-E 3.0 x8 (in x16),
4 PCI-E 3.0 x8,
1 PCI-E 3.0 x4 (in x8)
2 GbE LAN ports
8 SATA3 (6Gbps) ports
I/O: 1 VGA, 2 COM, TPM header
2 SuperDOM with built-in power
5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)
M.2 NGFF connector
M.2 Interface: PCI-E 3.0 x4 and SATA
Form Factor: 2280, 22110
Key: M-Key
Double Height Connector
Product SKUs
MBD-X11SPL-F
X11SPL-F
Physical Stats
Form Factor
ATX
Dimensions
12" x 9.6" (30.48cm x 24.38cm)
Processor/Cache
CPU
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Single Socket P (LGA 3647) supported, CPU TDP support 165W
Cores / Cache
Up to 28 cores
Note
BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP
System Memory
Memory Capacity
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
Memory Type
2933/2666/2400/2133MHz ECC DDR4 RDIMM, LRDIMM
DIMM Sizes
RDIMM: 8GB, 16GB, 32GB, 64GB
LRDIMM: 32GB, 64GB, 128GB
3DS LRDIMM: 64GB, 128GB, 256GB
Memory Voltage
1.2V
Error Detection
Corrects single-bit errors
On-Board Devices
Chipset
Intel® C621
SATA
Intel® C621 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10
IPMI
ASPEED AST2500
Network Controllers
Dual LAN with 1GbE with Intel® I210
Graphics
Aspeed AST2500 BMC
Input / Output
SATA
8 SATA3 (6Gbps) port
LAN
2 RJ45 Gigabit Ethernet LAN ports
USB
8 USB 2.0 ports (2 rear + 6 headers)
5 USB 3.0 ports (2 rear + 2 headers + 1 Type A)
Video Output
1 VGA port
Serial Port / Header
2 COM Ports (1 rear, 1 header)
TPM
TPM Header
Expansion Slots
PCI-E
2 PCI-E 3.0 x8 (in x16 slot),
4 PCI-E 3.0 x8,
1 PCI-E 3.0 x4 (in x8 slot)
M.2
M.2 Interface: PCI-E 3.0 x4 and SATA
Form Factor: 2280, 22110
Key: M-Key
Double Height Connector
System BIOS
BIOS Type
AMI UEFI
BIOS Features
ACPI 6.0
RTC (Real Time Clock) Wakeup
SMBIOS 3.0 or later
Management
Software
Intel® Node Manager, IPMI2.0, KVM with dedicated LAN, NMI, SPM, SUM, SuperDoctor® 5, Watchdog
Power Configurations
ACPI Power Management
Power-on mode for AC power recovery
PC Health Monitoring
Voltage
+1.8V, +12V, +3.3V, +5V, +5V standby, 3.3V standby, 7-fan status, Chassis intrusion header, HT, Monitors CPU voltages, Supports system management utility, VBAT
FAN
7x 4-pin fan headers (up to 7 fans), Fan speed control, Overheat LED indication, PWM fan speed control, System level control
Temperature
CPU thermal trip support, PECI
LED
CPU / System Overheat LED, UID/Remote UID, Suspend static indicator LED
Other Features
ACPI power management, Control of power-on for recovery from AC power loss, CPU thermal trip support for processor protection, M.2 NGFF connector, RoHS, UID, WOL
Operating Environment
Operating Temperature Range
0°C ~ 50°C (32°F ~ 122°F)
Non-Operating Temperature Range
-40°C - 70°C (-40°F - 158°F)
Operating Relative Humidity Range
8% - 90% (non-condensing)
Non-Operating Relative Humidity Range
5% - 95% (non-condensing)
Parts List (Bulk Package)
Name Part Number Qty Description
Motherboard MBD-X11SPL-F 1 X11SPL-F Motherboard
I/O Cables CBL-0044L 2 57.5 cm SATA FLAT S-S PBF
I/O Shield MCP-260-00042-0N 1 STD I/O Shield for X11SPL-F with EMI Gasket
Parts List (Retail Package)
Name Part Number Qty Description
Motherboard MBD-X11SPL-F 1 X11SPL-F Motherboard
QRG MNL-1950-QRG 1 Motherboard Quick Reference Guide
I/O Cables CBL-0044L 6 57.5 cm SATA FLAT S-S PBF
I/O Shield MCP-260-00042-0N 1 STD I/O Shield for X11SPL-F with EMI Gasket
Optional Parts List
Name Part Number Qty Description
TPM security module AOM-TPM-9670H SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor
TPM security module AOM-TPM-9670V SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
TPM security module AOM-TPM-9671H SPI capable TPM 1.2 with Infineon 9670 controller with horizontal form factor
TPM security module AOM-TPM-9671V SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor
Chassis (Optimized for X11SPL-F)
Embedded Compact 1U 2U 3U Mid/Mini-Tower 4U/Tower
SC512F-350B1
SC813MFTQC-350CB2
SC813MFTQC-R407CB
SC113MFAC2-341CB
SC113MFAC2-R606CB
SC113MFAC2-605CB
SC515-350
SC515-R407
SC514-R407C
1U Heatsink:SNK-P0067PS
SC823TQ-653LPB
SC825TQC-R740LPB
SC213LT-600LPB
SC213A-R740LPB
2U Heatsink:SNK-P0068APS4
SC833T-653B
2U Heatsink:SNK-P0068APS4
SC842TQC-668B
2U Heatsink:SNK-P0068APS4
Server (Optimized for X11SPL-F)
Server Name
SSG-5049P-E1CR45L
SSG-5049P-E1CR45H
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