Key Features
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W TDP
Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
Intel® C622 chipset
Expansion slots: 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (in x8)
2 10GbE LAN ports
12 SATA3 (6Gbps) via C622
Supports 12V DC power input
I/O: 1 VGA, 2 COM, TPM header
5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
M.2 NGFF connector
M.2 Interface: PCI-E 3.0 x4
Form Factor: 2242, 2280
Key: M-Key
Double Height Connector
Product SKUs
MBD-X11SPM-TF
X11SPM-TF
Physical Stats
Form Factor
microATX
Dimensions
9.6" x 9.6" (24.38cm x 24.38cm)
Processor/Cache
CPU
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Single Socket P (LGA 3647) supported, CPU TDP support 165W TDP
Cores / Cache
Up to 28 cores
Note
BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP
System Memory
Memory Capacity
Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
Memory Type
2933/2666/2400/2133MHz ECC DDR4 RDIMM, LRDIMM
DIMM Sizes
RDIMM: 8GB, 16GB, 32GB, 64GB
LRDIMM: 32GB, 64GB, 128GB
3DS LRDIMM: 64GB, 128GB, 256GB
Memory Voltage
1.2V
Error Detection
Corrects single-bit errors
On-Board Devices
Chipset
Intel® C622
SATA
Intel® C622 controller for 12 SATA3 (6 Gbps) ports; RAID 0,1,5,10
IPMI
ASPEED AST2500
Network Controllers
Dual LAN with 10GBase-T with Intel® X722 + X557
Graphics
Aspeed AST2500 BMC
Input / Output
SATA
12 SATA3 (6Gbps) port
LAN
2 RJ45 10GBase-T ports
USB
6 USB 2.0 ports (2 rear + 4 headers)
5 USB 3.0 ports (2 rear + 2 headers + 1 Type A)
Video Output
1 VGA port
Serial Port / Header
2 COM Ports (1 rear, 1 header)
TPM
TPM Header
Expansion Slots
PCI-E
2 PCI-E 3.0 x16,
1 PCI-E 3.0 x8
M.2
M.2 Interface: PCI-E 3.0 x4
Form Factor: 2242, 2280
Key: M-Key
Double Height Connector
System BIOS
BIOS Type
AMI UEFI
BIOS Features
ACPI 6.0
RTC (Real Time Clock) Wakeup
SMBIOS 3.0 or later
Management
Software
Intel® Node Manager, IPMI2.0, KVM with dedicated LAN, NMI, SPM, SUM, SuperDoctor® 5, Watchdog
Power Configurations
ACPI Power Management
Power-on mode for AC power recovery
PC Health Monitoring
Voltage
+1.8V, +12V, +3.3V, +5V, +5V standby, 3.3V standby, 8 -fan status, Chassis intrusion header, Monitors CPU voltages, Supports system management utility, VBAT
FAN
8x 4-pin fan headers (up to 8 fans), Fan speed control, Overheat LED indication, PWM fan speed control, System level control
Temperature
CPU thermal trip support, PECI
LED
CPU / System Overheat LED, UID/Remote UID, Suspend static indicator LED
Other Features
ACPI power management, Control of power-on for recovery from AC power loss, CPU thermal trip support for processor protection, M.2 NGFF connector, RoHS, UID, WOL
Operating Environment
Operating Temperature Range
0°C ~ 60°C (32°F ~ 140°F)
Non-Operating Temperature Range
-20°C ~ 60°C (-4°F ~ 140°F)
Operating Relative Humidity Range
10% ~ 85% (non-condensing)
Non-Operating Relative Humidity Range
10% ~ 95% (non-condensing)
Parts List (Bulk Package)
Name Part Number Qty Description
Motherboard MBD-X11SPM-TF 1 X11SPM-TF Motherboard
I/O Cables CBL-0044L 2 57.5 cm SATA FLAT S-S PBF
I/O Shield MCP-260-00109-0N 1 STD I/O Shield for X11SPM-TF with EMI Gasket
Parts List (Retail Package)
Name Part Number Qty Description
Motherboard MBD-X11SPM-TF 1 X11SPM-TF Motherboard
QRG MNL-1939-QRG 1 Motherboard Quick Reference Guide
I/O Cables CBL-0044L 4 57.5 cm SATA FLAT S-S PBF
I/O Shield MCP-260-00109-0N 1 STD I/O Shield for X11SPM-TF with EMI Gasket
Optional Parts List
Name Part Number Qty Description
TPM security module AOM-TPM-9670V SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
TPM security module AOM-TPM-9671V SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor
1U I/O Shield MCP-260-00114-0N 1U I/O Shield for X11SPM-TF with EMI Gasket
Chassis (Optimized for X11SPM-TF)
Embedded Compact 1U 2U 3U Mid/Mini-Tower 4U/Tower
SC813MFTQC-350CB2
SC813MFTQC-R407CB
SC113MFAC2-341CB
SC113MFAC2-R606CB
SC512F-350B1
SC515-350
SC514-R407C
SC515-R407
SC113MFAC2-605CB
1U Heatsink:SNK-P0067PS
SC823TQ-653LPB
SC213LT-600LPB
SC825TQC-R740LPB
SC213A-R740LPB
2U Heatsink:SNK-P0068APS4
SC833T-653B
2U Heatsink:SNK-P0068APS4
SC842TQC-668B
2U Heatsink:SNK-P0068APS4
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