Key Features
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
Intel® C622 chipset
Expansion slots:
1 PCI-E 3.0 x16 (x16 || x8),
1 PCI-E 3.0 x8 (x0 || x8),
1 PCI-E 3.0 x8,
1 PCI-E 3.0 x4 (in x8)
2 10G SFP+
10 SATA3 (6Gbps) via C622
8 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10
2x Port NVMe PCI-E 3.0 x4 via OCuLink
5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)
M.2 NGFF connector
M.2 Interface: PCI-E 3.0 x4 and SATA
Form Factor: 2280
Key: M-Key
Double Height Connector
Product SKUs
MBD-X11SPH-nCTPF
X11SPH-nCTPF
Physical Stats
Form Factor
ATX
Dimensions
12" x 9.6" (30.48cm x 24.38cm)
Processor/Cache
CPU
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Single Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP
Cores / Cache
Up to 28 cores
Note
BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP
System Memory
Memory Capacity
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
Memory Type
2933/2666/2400/2133MHz ECC DDR4 RDIMM, LRDIMM
DIMM Sizes
RDIMM: 8GB, 16GB, 32GB, 64GB
LRDIMM: 32GB, 64GB, 128GB
3DS LRDIMM: 64GB, 128GB, 256GB
Memory Voltage
1.2V
Error Detection
Corrects single-bit errors
On-Board Devices
Chipset
Intel® C622
SATA
Intel® C622 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
Broadcom® 3008 SW controller for 8 SAS3 (12Gbs) ports; RAID 0,1,10
IPMI
ASPEED AST2500
Network Controllers
Dual LAN with 10G SFP+ with Intel® X722 + Inphi CS4227
Graphics
Aspeed AST2500 BMC
Input / Output
SATA
10 SATA3 (6Gbps) port
LAN
2 10G SFP+ LAN ports
USB
8 USB 2.0 ports (2 rear + 6 headers)
5 USB 3.0 ports (2 rear + 2 headers + 1 Type A)
Video Output
1 VGA port
Serial Port / Header
2 COM Ports (1 rear, 1 header)
TPM
TPM Header
Expansion Slots
PCI-E
1 PCI-E 3.0 x16 (x16 or x8 ),
1 PCI-E 3.0 x8 (x0 or x8 ),
1 PCI-E 3.0 x8,
1 PCI-E 3.0 x4 (in x8 slot)
M.2
M.2 Interface: PCI-E 3.0 x4 and SATA
Form Factor: 2280
Key: M-Key
Double Height Connector
System BIOS
BIOS Type
AMI UEFI
BIOS Features
ACPI 6.0
RTC (Real Time Clock) Wakeup
SMBIOS 3.0 or later
Management
Software
Power Configurations
ACPI Power Management
Power-on mode for AC power recovery
PC Health Monitoring
Voltage
N/A
FAN
8x 4-pin fan headers (up to 8 fans)
Temperature
CPU thermal trip support, PECI
LED
CPU / System Overheat LED, UID/Remote UID, Suspend static indicator LED
Other Features
N/A
Operating Environment
Operating Temperature Range
0°C ~ 50°C (32°F ~ 122°F)
Non-Operating Temperature Range
-40°C - 70°C (-40°F - 158°F)
Operating Relative Humidity Range
8% - 90% (non-condensing)
Non-Operating Relative Humidity Range
5% - 95% (non-condensing)
Parts List (Bulk Package)
Name Part Number Qty Description
Motherboard MBD-X11SPH-nCTPF 1 X11SPH-nCTPF Motherboard
I/O Cables CBL-0044L 2 57.5 cm SATA FLAT S-S PBF
I/O Shield MCP-260-00109-0N 1 STD I/O Shield for X11SPH-nCTPF with EMI Gasket
Parts List (Retail Package)
Name Part Number Qty Description
Motherboard MBD-X11SPH-nCTPF 1 X11SPH-nCTPF Motherboard
QRG MNL-1949-QRG 1 Motherboard Quick Reference Guide
I/O Cables CBL-0044L 2 57.5 cm SATA FLAT S-S PBF
I/O Shield MCP-260-00109-0N 1 STD I/O Shield for X11SPH-nCTPF with EMI Gasket
Optional Parts List
Name Part Number Qty Description
1U I/O Shield MCP-260-00114-0N 1 1U I/O Shield for X11SPH-nCTPF with EMI Gasket
Chassis (Optimized for X11SPH-nCTPF)
Embedded Compact 1U 2U 3U Mid/Mini-Tower 4U/Tower
826BE1C-R802LPB
216BE1C4-R1K23LPB
823MTQC-R802LPB
825MBTQC-R802LPB
2U Heatsink:SNK-P0068APS4
SC836BE1C-R1K23B
SC847BE1C4-R1K23LPB
SC846BE1C-R1K23B
2U Heatsink:SNK-P0068APS4
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