Key Features
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C627
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
2 PCI-E 3.0 x16 Left Riser Slot
M.2 Interface: 1 PCI-E 3.0 x4
M.2 Form Factor: 2242/2260/2280
M.2 Key: M-Key
1 VGA D-Sub Connector port
Dual LAN with 10GBase-T with Intel® X557
Product SKUs
MBD-X11DSN-TSQ
X11DSN-TSQ
Physical Stats
Form Factor
Proprietary
Dimensions
11.5" x 13.9" (29.21cm x 35.31cm)
Processor/Cache
CPU
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
System Memory
Memory Capacity
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
Memory Type
N/A
DIMM Sizes
RDIMM: 64GB, 128GB
LRDIMM: 64GB, 128GB
3DS LRDIMM: 64GB, 128GB, 256GB
Memory Voltage
1.2V
Error Detection
Corrects single-bit errors
Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset
Intel® C627
IPMI
ASPEED AST2500
Network Controllers
Dual LAN with 10GBase-T with Intel® X557
Graphics
Aspeed AST2500 BMC
Input / Output
USB
3 USB 3.0 ports (2 rear + 1 Type A)
Video Output
1 VGA D-Sub Connector port
Serial Port / Header
2 COM Ports (1 rear, 1 header)
TPM
1 TPM Header
Expansion Slots
PCI-E
2 PCI-E 3.0 x16 Left Riser Slot
M.2
M.2 Interface: 1 PCI-E 3.0 x4
Form Factor: 2242/2260/2280
Key: M-Key
System BIOS
BIOS Type
AMI UEFI
Management
Software
Intel® Node Manager, IPMI (Intelligent Platform Management Interface) v2.0 with KVM support, IPMI2.0, KVM with dedicated LAN, NMI, SPM, SSM, SUM, SuperDoctor® 5, SuperDoctor® III, Watchdog
System Mangement Software
IPMI (Intelligent Platform Management Interface) v1.5 / 2.0 with KVM support
Power Configurations
M.2 NGFF connector, Node Manager Support, SDDC, System level control, UID, WOL
PC Health Monitoring
Voltage
+1.35V, +12V, +3.3V, +5V, +5V standby, 1.05 (PCH), 1.2V (VDIMM), Memory Voltages, Monitors CPU voltages, VBAT
FAN
4x 4-pin fan headers (up to 4 fans), Overheat LED indication, PWM fan speed control
Temperature
Monitoring for CPU and chassis environment
LED
CPU / System Overheat LED
Other Features
Chassis intrusion detection, Control of power-on for recovery from AC power loss, Innovation Engine, Intel® QuickAssist Technology , M.2 NGFF connector, Node Manager Support, RoHS, RoHS, Halogen Free, UID, WOL
Operating Environment
Operating Temperature Range
10°C - 35°C (50°F - 95°F)
Non-Operating Temperature Range
-20°C ~ 60°C (-4°F ~ 140°F)
Operating Relative Humidity Range
8% - 90% (non-condensing)
Non-Operating Relative Humidity Range
10% ~ 95% (non-condensing)
Parts List (Bulk Package)
Name Part Number Qty Description
Motherboard MBD-X11DSN-TSq 1 X11DSN-TSq Motherboard
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Server (Optimized for X11DSN-TSQ)
Server Name
SSG-2029P-DN2RR32L